Axcelis Technologies is a Beverly, Massachusetts-based company that designs, manufactures, and services ion implant systems used in the fabrication of semiconductor devices. Ion implantation is a foundational process in semiconductor manufacturing by which dopant ions (boron, arsenic, phosphorus, and others) are accelerated and embedded into silicon and compound semiconductor wafers to define transistor source, drain, and well regions with precise concentration profiles controlled by dose, energy, and angle. Axcelis's Purion family of ion implanters spans high-current (high-dose, low-energy) applications used for source/drain doping, to high-energy platforms for deep retrograde well formation, to medium-current systems for general implant applications. For semiconductor research facilities at universities and research institutes, Axcelis implanters are the standard tools for studying implant-induced defects, dopant diffusion, crystal recovery after implantation damage, and novel doping strategies in emerging semiconductor materials including gallium nitride, silicon carbide, and germanium. Their Purion H Ultra for silicon carbide applications supports the rapidly growing SiC power device research market, where conventional silicon implant processes must be adapted for the harder, more radiation-resistant SiC substrate. Axcelis also develops advanced cryogenic and hot implant capabilities that expand the parameter space available to process researchers. Their work on metal-ion implantation for magnetic device research and on implant-defined color center creation in diamond for quantum information applications connects the company to frontier materials research programs.
R&D SPEND
$95M
INDUSTRY
Ion Implantation Systems
280
ACADEMIC COLLABORATIONS
1200
PATENTS
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